Pc-concepts SHG2 DP Manuel d'utilisateur télécharger pdf (Page 85)

Intel® SHG2 DP Server Board Technical Product Specification General Specifications

Revision 1.0 Intel Order Number C11343-001

9.2 Airflow Specification for CIOB-X2 and CMIC-LE

The maximum thermal specifications for components listed require installation of a heat sink or

maintenance of a minimum level of airflow. Failure to maintain sufficient cooling airflow will

result in components exceeding maximum case temperature. Table 61 lists several chipset

components and their required airflow.

Table 61. Airflow Specification for Key Components

Component Maximum Power T

at 1 M/sec

Airflow

(Max)

CIOB-X2 7.0 W 28 C/W 0.4 C/W 100 C

CMIC-LE 10 W 5 C/W 0.2 C/W 100 C

9.3 Electrical Specifications

DC and AC specifications for the SHG2 server board are summarized here.

9.3.1 Power Consumption

Table 62 shows the power consumed on each supply line for a SHG2 baseboard configured

with two processors, each a 65W maximum, and 2 DIMMs stacked burst with 4 DIMMs in

standby at 70% maximum.

Note: The following numbers are provided as an example. Actual power consumption will vary

depending on the exact SHG2 configuration.

Table 62. SHG2 Power Budget

Description # Items 3.3v 5v 12v -12v 5v stby 3.3v stb

Peripheral Bay 2 0.7 0.7

Hard Drives 5 4.7 5.6

Add-In Slots 3 6.1 2.0

Cooling 6 2.5

Processors 4 12.7

Server board (Misc.) 1 1.5 2.7

Quick Server board Spec 1 3.8 5.1 1.4 0.2 1.5

Total Power (Amps) 9.8 14.0 25.5 0.2 1.5

Total Power (Watts) 32.4 69.8 306.2 2.4 7.7

Total

Watts 418

For your system or configured calculations, please add the power consumed by all devices

plugged into the server board.

1 2 ... 80 81 82 83 84 85 86 87 88 89 90 ... 96 97

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Pc-concepts SHG2 DP Manuel d'utilisateur Page 85